Recently, Guangdong Puhong Semiconductor presented its new-generation mold cleaning strips and eco-friendly release materials at industry exhibitions. Suitable for automotive electronics, power devices, LED packaging and other high-growth sectors, the products effectively cut mold maintenance costs and raise packaging yield for packaging & testing lines.

Our on-site technical team held exchanges with multiple packaging and testing manufacturers, providing customized material solutions for different molding equipment and EMC systems. Puhong will keep focusing on customer demands, iterate semiconductor packaging auxiliary materials, and deepen cooperation across the packaging & testing industrial chain.