The relocation and expansion project of rubber materials for chip packaging by Guangdong Puhong Semiconductor Co., Ltd. is moving forward orderly. Located in Gulao Town, Heshan, Jiangmen, the project is planned to achieve an annual output of 1,000 tons of rubber materials for chip packaging and 1,500 tons of plastic parts for home appliances.

With years of expertise in semiconductor packaging auxiliary materials, Puhong mainly supplies mold cleaning strips, release pellets, eco-friendly mold cleaner and other special electronic materials. Its products fit packaging scenarios including IC, BGA, power devices and LEDs.

This capacity expansion will further strengthen our large-scale manufacturing capability. Supported by the 30,000 ㎡ modern production base in Jiangmen, we will keep delivering domestic packaging consumable solutions for domestic packaging & testing enterprises and support self-reliance of the semiconductor packaging material supply chain.